Input sensing unit and electronic apparatus including the same

ABSTRACT

An input sensor includes: a first connection pattern; a second connection pattern on a layer different from the first connection pattern and electrically disconnected from the first connection pattern; a first sensor pattern on a layer different from the first connection pattern and coupled to the first connection pattern; a second sensor pattern on a layer different from the first connection pattern and coupled to the second connection pattern; and a floating pattern overlapping at least a portion of the first connection pattern when viewed in a plan view and spaced apart from the second connection pattern.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/906,630, filed Jun. 19, 2020, which claims priority to and thebenefit of Korean Patent Application No. 10-2019-0079640, filed Jul. 2,2019, the entire content of both of which is incorporated herein byreference.

BACKGROUND 1. Field

An embodiment of the present disclosure relates to an input sensing unitand an electronic apparatus including the same.

2. Description of the Related Art

An electronic apparatus may be activated by an electrical signal appliedthereto. The electronic apparatus may include an input sensing unit,which is used to sense a variety of inputs provided from the outside(e.g., from an external object). To improve a user's convenience, theinput sensing unit is used alone or as a part of a display device fordisplaying an image.

The input sensing unit includes a variety of electrode patterns, whichare activated by electrical signals. An active region, in which theelectrode patterns are activated, may be used to display imageinformation or to sense an external touch event.

External light, which is incident into the electronic apparatus from theoutside of the electronic apparatus, is reflected by the electrodepatterns and is emitted to the outside. The reflected light isrecognized by a user located outside of the electronic apparatus. Thereflected light affects visibility of the active region.

The above information disclosed in this Background section is only forenhancement of understanding of the background and therefore theinformation discussed in this Background section does not necessarilyconstitute prior art.

SUMMARY

An embodiment of the present disclosure relates to an input sensing unitand an electronic apparatus including the same, and for example, to aninput sensing unit with improved visibility and an electronic apparatusincluding the same.

An embodiment of the inventive concept include an input sensing unitwith relatively improved visibility and an electronic apparatusincluding the same.

In an embodiment of the inventive concept, an input sensing unit mayinclude a first connection pattern, a second connection pattern, whichis disposed on a layer different from the first connection pattern andis electrically disconnected from the first connection pattern, a firstsensor pattern, which is disposed on a layer different from the firstconnection pattern and is coupled to the first connection pattern, asecond sensor pattern, which is disposed on a layer different from thefirst connection pattern and is coupled to the second connectionpattern, and a floating pattern, which is overlapped with at least aportion of the first connection pattern when viewed in a plan view andis spaced apart from the second connection pattern.

In an embodiment, the floating pattern and the second connection patternmay be disposed on the same layer.

In an embodiment, the floating pattern may be spaced apart from thesecond sensor pattern, when viewed in a plan view.

In an embodiment, the floating pattern may be electrically disconnectedfrom the first sensor pattern, the second sensor pattern, and the secondconnection pattern.

In an embodiment, the floating pattern and the second connection patternmay be disposed on different layers.

In an embodiment, the floating pattern may be overlapped with the secondsensor pattern, when viewed in a plan view.

In an embodiment, the second sensor pattern may include a plurality offirst mesh lines, each of which is extended in a first direction, and aplurality of second mesh lines, each of which is extended in a seconddirection crossing the first direction and is in contact with the firstmesh lines. One of the first and second mesh lines overlapped with thefirst connection pattern may be extended in a direction crossing anextension direction of the first connection pattern.

In an embodiment, the floating pattern may be spaced apart from thefirst and second mesh lines overlapped with the first connection patternand may be extended in a direction parallel to an extension direction ofthe first connection pattern.

In an embodiment, an extension direction of the floating pattern may bethe first direction or the second direction.

In an embodiment, the floating pattern may be spaced apart fromintersections of the first mesh lines and the second mesh lines.

In an embodiment, an overlapping area between the floating pattern andthe first connection pattern may range from about 10% to 90% of an areaof the first connection pattern.

In an embodiment, the floating pattern may include the same material asthe second sensor pattern.

In an embodiment, the input sensing unit may further include a thirdconnection pattern, which is disposed on the same layer as the firstconnection pattern and is spaced apart from the first connection patternand the second connection pattern when viewed in a plan view, a thirdsensor pattern, which is disposed on a layer different from the thirdconnection pattern and is coupled to the third connection pattern, andan additional floating pattern, which is disposed on a layer differentfrom the third connection pattern and is overlapped with at least aportion of the third connection pattern when viewed in a plan view.

In an embodiment, the third connection pattern may be disposed to crossthe first sensor pattern and may be electrically disconnected from thefirst sensor pattern. The additional floating pattern may be spacedapart from the first sensor pattern, when viewed in a plan view.

In an embodiment of the inventive concept, an electronic apparatus mayinclude a base substrate and an input sensing unit, which is disposed onthe base substrate to sense an external input. The input sensing unitmay include a first connection pattern, a second connection pattern,which is disposed on a layer different from the first connection patternand is electrically disconnected from the first connection pattern, afirst sensor pattern, which is disposed on a layer different from thefirst connection pattern and is coupled to the first connection pattern,a second sensor pattern, which is disposed on a layer different from thefirst connection pattern and is coupled to the second connectionpattern, and a floating pattern, which is overlapped with at least aportion of the first connection pattern when viewed in a plan view. Thesecond sensor pattern may include a plurality of first mesh lines, eachof which is extended in a direction, and a plurality of second meshlines, which are connected to the first mesh lines to form a pluralityof intersections with the first mesh lines. The first connection patternmay be disposed to cross the first mesh lines and the second mesh linesand may be electrically disconnected from the first mesh lines and thesecond mesh lines.

In an embodiment, the floating pattern may be disposed on the same layeras the first mesh lines and the second mesh lines and may be spacedapart from the first mesh lines and the second mesh lines when viewed ina plan view.

In an embodiment, the floating pattern may be extended along a directioncrossing the first mesh lines to be disposed between the first meshlines or may be extended along a direction crossing the second meshlines to be disposed between the second mesh lines.

In an embodiment, the floating pattern may include a plurality ofpatterns, which are spaced apart from each other. The patterns may bearranged along the first connection pattern and may be spaced apart fromthe first mesh lines and the second mesh lines when viewed in a planview.

In an embodiment, an overlapping area between the floating pattern andthe first connection pattern may range from about 10% to 90% of an areaof the first connection pattern.

In an embodiment, the electronic apparatus may further include a displayunit, which is disposed between the base substrate and the input sensingunit and includes a plurality of light-emitting regions. The first meshlines and the second mesh lines may be spaced apart from thelight-emitting regions, when viewed in a plan view.

BRIEF DESCRIPTION OF THE DRAWINGS

An embodiment will be more clearly understood from the following briefdescription taken in conjunction with the accompanying drawings. Theaccompanying drawings represent non-limiting, example embodiments asdescribed herein.

FIG. 1 is a perspective view illustrating an electronic apparatus in anembodiment of the inventive concept.

FIGS. 2A to 2F are sectional views, each of which illustrates anelectronic apparatus in an embodiment of the inventive concept.

FIG. 3 is a plan view briefly illustrating an electronic apparatus in anembodiment of the inventive concept.

FIG. 4 is a sectional view illustrating a region of the electronicapparatus of FIG. 3.

FIG. 5A is an enlarged plan view illustrating a region of FIG. 3.

FIGS. 5B and 5C are plan views illustrating some of the elements shownin FIG. 5A.

FIG. 6A is a sectional view taken along a line I-I′ of FIG. 5.

FIG. 6B is a sectional view taken along a line II-II′ of FIG. 5.

FIG. 6C is a sectional view illustrating a portion of an electronicapparatus in an embodiment of the inventive concept.

FIGS. 7A and 7B are plan views, each of which illustrates a portion ofan input sensing unit in an embodiment of the inventive concept.

FIG. 8A is a plan view illustrating an input sensing unit in anembodiment of the inventive concept.

FIG. 8B is a sectional view taken along a line III-III′ of FIG. 8A.

FIG. 9A is a plan view illustrating an electronic apparatus in anembodiment of the inventive concept.

FIG. 9B is a plan view illustrating a portion of the electronicapparatus of FIG. 9A.

It should be noted that these figures are intended to illustrate thegeneral characteristics of methods, structure and/or materials utilizedin certain example embodiments and to supplement the written descriptionprovided below. These drawings are not, however, to scale and may notprecisely reflect the precise structural or performance characteristicsof any given embodiment, and should not be interpreted as defining orlimiting the range of values or properties encompassed by exampleembodiments. For example, the relative thicknesses and positioning ofmolecules, layers, regions and/or structural elements may be reduced orexaggerated for clarity. The use of similar or identical referencenumbers in the various drawings is intended to indicate the presence ofa similar or identical element or feature.

DETAILED DESCRIPTION

An embodiment of the inventive concepts will now be described more fullywith reference to the accompanying drawings, in which exampleembodiments are shown. Example embodiments of the inventive conceptsmay, however, be embodied in many different forms and should not beconstrued as being limited to the embodiments set forth herein; rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the concept of example embodimentsto those of ordinary skill in the art. In the drawings, the thicknessesof layers and regions are exaggerated for clarity. Like referencenumerals in the drawings denote like elements, and thus theirdescription will be omitted.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. Like numbers indicate like elementsthroughout. As used herein the term “and/or” includes any and allcombinations of one or more of the associated listed items. Other wordsused to describe the relationship between elements or layers should beinterpreted in a like fashion (e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” “on” versus “directlyon”).

It will be understood that, although the terms “first”, “second”, etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another element, component, region, layer or section. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises”, “comprising”, “includes” and/or “including,” if usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Example embodiments of the inventive concepts are described herein withreference to cross-sectional illustrations that are schematicillustrations of idealized embodiments (and intermediate structures) ofexample embodiments. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, example embodiments of theinventive concepts should not be construed as limited to the particularshapes of regions illustrated herein but are to include deviations inshapes that result, for example, from manufacturing.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments of theinventive concepts belong. It will be further understood that terms,such as those defined in commonly-used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense unless expressly so defined herein.

FIG. 1 is a perspective view illustrating an electronic apparatus in anembodiment of the inventive concept. An electronic apparatus EA may beactivated by an electrical signal applied thereto. The electronicapparatus EA may include a display surface IS, which is defined by aplane extending along a first direction DR1 and a second direction DR2.The display surface IS of the electronic apparatus may be is selectivelyactivated by an electrical signal applied thereto. When viewed in a planview, the display surface IS may be divided into an active region AA anda peripheral region NAA.

The active region AA may be a region that is electrically activated whenan electrical signal is supplied thereto. According to the design of theelectronic apparatus EA, the active region AA may be activated toperform various functions.

In an embodiment, the active region AA may be a sensing region, which isused to sense an input event provided from the outside. As shown in FIG.1, the electronic apparatus EA may sense an external input TC applied tothe active region AA. That is, the electronic apparatus EA may serve asan input device.

FIG. 1 illustrates an example in which a user's hand is used as theexternal input TC, but various external inputs may be used as theexternal input TC. For example, the external input TC may be provided invarious forms including a contact type touch (e.g., by a user's hand orfinger, a stylus, etc.), a non-contact type touch (e.g., proximitysensing), force, pressure, or light, but the inventive concept is notlimited to a specific type of the external input TC.

In addition, the active region AA may be a display region of displayinginformation. The electronic apparatus EA may display an image IM on theactive region AA, and in this case, a user may obtain information fromthe image IM. In this sense, the electronic apparatus EA may be used asan output device or graphical interface.

The peripheral region NAA may be located adjacent to the active regionAA. The peripheral region NAA may not be used to display an image or tosense an external input, even when the electronic apparatus EA isactivated or an electrical signal is applied to the peripheral regionNAA.

Signal lines for providing external signals to the active region AA ordriving devices for driving the active region AA may be located in theperipheral region NAA. The peripheral region NAA may be adjacent to atleast one of edge regions of the active region AA.

In an embodiment, the peripheral region NAA is illustrated to have aframe shape surrounding the active region AA. However, embodimentsaccording to the inventive concept are not limited thereto, and incertain embodiments, the peripheral region NAA may be omitted from theelectronic apparatus EA. The shape of the peripheral region NAA may bevariously changed, and the inventive concept is not limited to aspecific shape of the peripheral region NAA.

FIG. 1 illustrates an example in which the electronic apparatus EA is atouch screen apparatus. However, the inventive concept is not limited tothis example, and according to some embodiments, the electronicapparatus EA may not have a display function.

FIGS. 2A to 2F are sectional views, each of which illustrates anelectronic apparatus in an embodiment of the inventive concept. FIGS. 2Ato 2F illustrate vertical sections, each of which is taken parallel to aplane defined by the second and third directions DR2 and DR3. In FIGS.2A to 2F, some examples of a stacking structure of functional panelsand/or functional units constituting the electronic apparatus EA areillustrated in a simplified manner.

In an embodiment, the electronic apparatus EA may include a displaypanel, an input sensing unit (or input sensor), an anti-reflection unit(or anti-reflector), and a window unit (or window). At least some of thedisplay panel, the input sensing unit, the anti-reflection unit, and thewindow unit may be successively formed by a successive process or may bebonded to each other by an adhesive member. FIGS. 2A to 2F illustrateexamples in which a pressure sensitive adhesive film PSA is used as theadhesive member. However, in an embodiment to be described in moredetail below, the adhesive member may be any suitable adhesive materialor a gluing agent. In an embodiment, the anti-reflection unit and lightcontrol unit may be replaced with other unit or may be omitted.

In FIGS. 2A to 2F, if one of the input-sensing unit, the anti-reflectionunit, the light control unit (or light controller), or the window unitis formed on another element by a successive process, the unit will beexpressed using a term “layer”. By contrast, if one of the input sensingunit, the anti-reflection unit, the light control unit, or the windowunit is bonded to another element by an adhesive member, the unit willbe expressed using a term “panel”. The unit expressed using the term“panel” may include a base layer (e.g., a synthetic resin film, acomposite film, or a glass substrate) providing a base surface, but forthe unit expressed using the term “layer”, the base layer may beomitted. In other words, the unit expressed using the term “layer” maybe disposed on a base surface that is disposed by another element orunit.

The input sensing unit, the anti-reflection unit, and the window unitmay be referred to as an input sensing panel ISP, an anti-reflectionpanel RPP, and a window panel WP or to as an input sensing layer ISL, ananti-reflection layer RPL, and a window layer WL, according to thepresence or absence of the base layer.

As shown in FIG. 2A, an electronic apparatus EA1 may include a displaypanel DP, the input sensing layer ISL, the anti-reflection panel RPP,the window panel WP, and a protection member PF. The input sensing layerISL may be directly disposed on the display panel DP. In thespecification, the expression “an element B1 may be directly disposed onan element A1” may mean that an adhesive member is not disposed betweenthe elements A1 and B1. After the formation of the element A1, theelement B1 may be formed on a base surface, which is provided by theelement A1, through a successive process.

Pressure sensitive adhesive (PSA) films may be respectively disposedbetween the input sensing layer ISL and the anti-reflection panel RPP,between the anti-reflection panel RPP and the window panel WP, andbetween the display panel DP and the protection member PF.

The display panel DP may display the image IM (e.g., see FIG. 1), andthe input sensing layer ISL may obtain information regarding coordinatesof the external input TC (e.g., see FIG. 1). The protection member PFmay support the display panel DP and may protect the display panel DPfrom an external impact.

The protection member PF may include a plastic film serving as a baselayer. The protection member PF may include a plastic film containingone selected from the group consisting of thermoplastic resins (e.g.,polyethylene terephthalate (PET), polyethylene (PE), polyvinylchloride(PVC), polypropylene (PP), polystyrene (PS), polyacrylonitrile (PAN),styrene-acrylonitrile copolymer (SAN), acrylonitrile-butadiene-styrene(ABS), polymethyl methacrylate (PMMA), and combinations thereof). In thecase where the protection member PF is formed of polyethyleneterephthalate (PET), the protection member PF may be excellent inheat-resistant, fatigue strength, and electric characteristics and maybe insensitive to temperature and humidity.

Materials for the protection member PF are not limited to plasticresins, and organic/inorganic composites may be used for the protectionmember PF. The protection member PF may include a porous organic layerand an inorganic material filling pores of the organic layer.

In an embodiment of the inventive concept, the display panel DP may be alight-emitting type display panel, but embodiments according to theinventive concept are not limited to a specific type of the displaypanel DP. For example, the display panel DP may be an organic lightemitting display panel or a quantum dot light emitting display panel. Alight emitting layer of the organic light emitting display panel may beformed of or include an organic luminescent material. A light emittinglayer of the quantum dot light emitting display panel may includequantum dots and/or quantum rods. For the sake of simplicity, thedescription that follows will refer to an example in which the displaypanel DP is the organic light emitting display panel.

The anti-reflection panel RPP may reduce reflectance of a natural orsolar light that is incident from an outer space to the window panel WP.In an embodiment, the anti-reflection panel RPP may include a phaseretarder and a polarizer. The phase retarder may be of a film type or aliquid crystal coating type and may include a λ/2 and/or λ/4 phaseretarder. The polarizer may also be of a film type or a liquid crystalcoating type. The polarizer of the film type may include an elongatedsynthetic resin film, whereas the polarizer of the liquid crystalcoating type may include liquid crystals arranged with a specificorientation. The phase retarder and the polarizer may further include aprotection film. At least one of the phase retarder, the polarizer, orthe protection films thereof may be used as a base layer of theanti-reflection panel RPP.

In an embodiment, the anti-reflection panel RPP may include colorfilters. The color filters may be arranged in a specific manner. Thearrangement of the color filters may be determined in consideration ofcolors of lights to be emitted from pixels in the display panel DP. Theanti-reflection panel RPP may further include a black matrix that isadjacent to the color filters.

In an embodiment, the window panel WP may include a base layer WP-BS anda light-blocking pattern WP-BZ. The base layer WP-BS may include a glasssubstrate and/or a synthetic resin film. The base layer WP-BS may not belimited to a single-layered structure. The base layer WP-BS may includetwo or more films that are attached to each other by an adhesive member.

The light-blocking pattern WP-BZ may be partially overlapped with thebase layer WP-BS. The light-blocking pattern WP-BZ may be located on therear surface of the base layer WP-BS to define a bezel region of theelectronic apparatus EA (e.g., the peripheral region NAA of FIG. 1).

The light-blocking pattern WP-BZ may be a colored organic layer and maybe formed by, for example, a coating method. In an embodiment, thewindow panel WP may further include a functional coating layer providedon the front surface of the base layer WP-BS. The functional coatinglayer may include an anti-fingerprint layer, an anti-reflection layer, ahard coating layer, and so forth.

In FIGS. 2B to 2F, the window panel WP and the window layer WL arebriefly illustrated without distinction between the base layer WP-BS andthe light-blocking pattern WP-BZ.

As shown in FIGS. 2B and 2C, an electronic apparatus EA2 or EA3 mayinclude the protection member PF, the display panel DP, the inputsensing panel ISP, the anti-reflection panel RPP, and the window panelWP. A stacking order of the input sensing panel ISP and theanti-reflection panel RPP may be changed.

As shown in FIG. 2D, an electronic apparatus EA4 may include theprotection member PF, the display panel DP, the input sensing layer ISL,the anti-reflection layer RPL, and the window layer WL. Adhesive membersmay be omitted from the electronic apparatus EA4, and the input sensinglayer ISL, the anti-reflection layer RPL, and the window layer WL may beformed on a base surface, which is provided by the display panel DP, bya successive process. A stacking order of the input sensing layer ISLand the anti-reflection layer RPL may be changed.

Here, the anti-reflection layer RPL may include a liquid crystal coatingtype phase retarder and a liquid crystal coating type polarizer. Thephase retarder and the polarizer may include a discotic liquid crystallayer having a tilt angle in a specific direction.

As shown in FIGS. 2E and 2F, an electronic apparatus EA5 or EA6 may notinclude an independent anti-reflection layer. Unlike the input sensingpanel ISP or the input sensing layer ISL shown in FIGS. 2A to 2D, aninput sensing layer ISL-1 shown in FIG. 2E may further include a colorfilter having an anti-reflection function. Unlike the display panel DPillustrated in FIGS. 2A to 2D, a display panel DP-1 shown in FIG. 2F mayfurther include a color filter having an anti-reflection function.

FIG. 3 is a plan view briefly illustrating an electronic apparatus in anembodiment of the inventive concept. FIG. 4 is a sectional viewillustrating a region of the electronic apparatus of FIG. 3. Forconvenience in illustration, a part of the electronic apparatus (e.g., adisplay unit (or display) DU and an input sensing unit ISU) isillustrated in FIGS. 3 and 4, and a region of the active region AA isillustrated in FIG. 4. Hereinafter, the electronic apparatus in anembodiment of the inventive concept will be described with reference toFIGS. 3 and 4.

In an embodiment, the input sensing unit ISU is illustrated to bedisposed on the display unit DU. However, embodiments according to theinventive concept are not limited to this example, and in an embodiment,the input sensing unit ISU may be disposed below the display unit DU ormay be inserted in the display unit DU. The position of the inputsensing unit ISU may be variously changed, and the inventive concept isnot limited to a specific position of the input sensing unit ISU.

Referring to FIG. 4, the display unit DU may include a base layer BL, apixel definition layer PDL, a display device ED, and an encapsulationlayer EC. The display unit DU may include a plurality of light-emittingregions PXA and a plurality of non-light-emitting regions NPXA, whichare arranged in the active region AA. Although only two regions of thelight emitting regions PXA are illustrated in FIG. 4, the inventiveconcept is not limited thereto.

In an embodiment, the base layer BL may include a plurality ofinsulating layers and a plurality of conductive layers. The conductivelayers and the insulating layers may constitute a thin-film transistorand a capacitor, which are connected to the display device ED.

The pixel definition layer PDL may be disposed on the base layer BL.Openings may be defined in the pixel definition layer PDL. The openingsmay define the light emitting regions PXA, respectively.

The display devices ED may be disposed on the base layer BL. The displaydevices ED may be disposed at positions corresponding to the openings,respectively. The display device ED may emit light, which constitutes animage to be displayed, in response to electrical signals, which aretransmitted through the thin-film transistor and the capacitorconstituting the base layer BL.

The display device ED may be realized in various forms. For example, thedisplay device ED may be an electrophoretic device, a liquid crystalcapacitor, an electrowetting device, an organic light emitting device, aquantum dot light emitting device, a micro LED, or a nano LED. Thedescription that follows will refer to an example in which the displaydevice ED is an organic light emitting device.

The display device ED may include a first electrode EL1, a lightemitting layer EML, and a second electrode EL2. In the display deviceED, a potential difference between the first electrode EU and the secondelectrode EL2 may be adjusted to activate the light emitting layer EMLor to emit light from the light emitting layer EML. Thus, the lightemitting regions PXA may correspond to regions, on which the lightemitting layers EML are disposed.

The light emitting regions PXA may have at least two different sizes orareas. For example, the area of each of the light emitting regions PXAmay be determined based on color of light emitted therefrom. That is, inan embodiment of the inventive concept, the light emitting region mayhave an area or size suitable for the color of light emitted therefrom,and this may allow various colors to have uniform optical efficiency.

The encapsulation layer EC may cover the display device ED. Theencapsulation layer EC may include at least one inorganic layer and/orat least one organic layer. The encapsulation layer EC may preventmoisture from entering the display device ED and protect the displaydevice ED. In addition, the encapsulation layer EC may be disposedbetween the display device ED and the input sensing unit ISU toelectrically separate the display device ED from the input sensing unitISU. However, the inventive concept is not limited to this example, andin certain embodiments, the encapsulation layer EC may be provided inthe form of a glass substrate or a plastic substrate. In this case, aspace between the encapsulation layer EC and the display device ED maybe filled with an inert or inactive gas. The structure of the displayunit DU may be variously changed, and the inventive concept is notlimited to a specific structure of the display unit DU.

The input sensing unit ISU may be directly disposed on the encapsulationlayer EC. For example, the input sensing unit ISU may be directlydeposited on a top surface of the encapsulation layer EC and then may bepatterned. However, embodiments according to the inventive concept arenot limited to this example, and in an embodiment, the electronicapparatus EA may further include another element (e.g., a color filteror a buffer layer), which is interposed between the input sensing unitISU and the encapsulation layer EC.

Referring to FIG. 3, the input sensing unit ISU may include a firstsensing electrode TE1, a second sensing electrode TE2, first signallines SL11 and SL12, a second signal line SL2, and a pad PD.

The first sensing electrode TE1 may be extended in the first directionDR1. In an embodiment, a plurality of the first sensing electrodes TE1may be arranged in the second direction DR2. The first sensing electrodeTE1 may include a plurality of first sensor patterns SP1, which arearranged in the first direction DR1, and a plurality of first connectionpatterns CP1, which are disposed between the first sensor patterns SP1to connect adjacent ones of the first sensor patterns SP1 to each other.

The second sensing electrode TE2 may be disposed to be electricallydisconnected from the first sensing electrode TE1. The second sensingelectrode TE2 may be extended in the second direction DR2. In anembodiment, a plurality of the second sensing electrodes TE2 may bearranged in the first direction DR1. The second sensing electrode TE2may include a plurality of second sensor patterns SP2, which arearranged in the second direction DR2, and a plurality of secondconnection patterns CP2, which are disposed between the second sensorpatterns SP2 to connect adjacent ones of the second sensor patterns SP2to each other.

The input sensing unit ISU may sense the external input TC (e.g., seeFIG. 1) by sensing a change in capacitance between the first sensingelectrode TE1 and the second sensing electrode TE2 or by sensing achange in capacitance of each of the first and second sensing electrodesTE1 and TE2. In an embodiment, the input sensing unit ISU may sense theexternal input TC in various manners, and the inventive concept is notlimited to a specific embodiment.

The first signal lines SL11 and SL12 may be connected to the firstsensing electrode TE1. The first signal lines SL11 and SL12 may bedisposed in the peripheral region NAA and may not be recognized by auser. The second signal line SL2 may be connected to the second sensingelectrode TE2. The second signal line SL2 may be disposed in theperipheral region NAA and may not be recognized by a user.

In an embodiment, the first signal lines SL11 and SL12 may include anupper signal line SL11 and a lower signal line SL12. The upper signalline SL11 may be connected to an upper portion of the first sensingelectrode TE1, and the lower signal line SL12 may be connected to alower portion of the first sensing electrode TE1.

The upper signal line SL11 and the lower signal line SL12 may beconnected to pads PD11 and PD12, respectively, which are spaced apartfrom each other. Thus, even when the first sensing electrode TE1 islonger than the second sensing electrode TE2, it may be possible touniformly apply an electrical signal to the entire region of the inputsensing unit ISU. Accordingly, regardless of the shape of the inputsensing unit ISU, the input sensing unit ISU may provide a uniform touchsensing environment throughout the entire region of the active regionAA.

However, the inventive concept is not limited to this example. As anexample, opposite ends of the first sensing electrode TE1 may also beconnected to a pair of signal lines. As another example, an end of eachof the first and second sensing electrodes TE1 and TE2 may be connectedto a signal line. Furthermore, the input sensing unit ISU may beoperated in various manners, but the inventive concept is not limited toa specific operation method.

The pads PD may include first pads PD11 and PD12 and a second pad PD2.As described above, each of the pads PD may be connected to acorresponding one of the first signal lines SL11 and SL12 or the secondsignal line SL2 and may be electrically connected to the first sensingelectrode TE1 or the second sensing electrode TE2. Electrical signals,which are provided from the outside, may be provided to the inputsensing unit ISU through the pads PD.

Referring back to FIG. 4, the input sensing unit ISU may include aplurality of conductive layers and a plurality of insulating layers,which are vertically stacked. In an embodiment, the input sensing unitISU may include a first conductive layer 10, a second conductive layer20, a first insulating layer 30, and a second insulating layer 40, whichare disposed on different layers or at different levels.

The first conductive layer 10 may be disposed on the display panel DP.The second conductive layer 20 may be disposed on the first conductivelayer 10 and the first insulating layer 30. Each of the first sensingelectrode TE1, the second sensing electrode TE2, the first signal linesSL11 and SL12, the second signal line SL2, and the pads PD may beincluded in one of the first and second conductive layers 10 and 20.

Each of the first and second conductive layers 10 and 20 may include aplurality of conductive patterns. The conductive patterns may includethe first sensing electrode TE1, the second sensing electrode TE2, thefirst signal lines SL11 and SL12, the second signal line SL2, and thepads PD described above.

The conductive patterns constituting each of the first and secondconductive layers 10 and 20 may not be overlapped the light emittingregions PXA, when viewed in a plan view. In this case, even if the firstand second conductive layers 10 and 20 are formed of an opaque material,it may be possible to prevent the first and second conductive layers 10and 20 from affecting the image IM displayed on the light emittingregions PXA. However, embodiments according to the inventive concept arenot limited to this example or a specific embodiment, and each of thefirst and second conductive layers 10 and 20 may include a conductivepattern or an optically transparent conductive pattern that isoverlapped with at least a portion of the light emitting regions PXA.

The first insulating layer 30 may be provided between the first andsecond conductive layers 10 and 20. When viewed in a sectional view, thefirst insulating layer 30 may separate the first conductive layer 10from the second conductive layer 20. The first conductive layer 10 and aportion of the second conductive layer 20 may be electrically connectedto each other through a contact hole CH, which is formed to penetratethe first insulating layer 30.

The second insulating layer 40 may be disposed on the first insulatinglayer 30. The second insulating layer 40 may cover the second conductivelayer 20. The second insulating layer 40 may protect the secondconductive layer 20 from an external environment.

The first and second insulating layers 30 and 40 may have an insulatingproperty and an optically transparent property. Accordingly, even whenthe light-emitting region PXA is covered with the first and secondinsulating layers 30 and 40, light from the light emitting region PXAmay be easily recognized by a user located outside the input sensingunit ISU.

The first insulating layer 30 and the second insulating layer 40 mayinclude at least one inorganic layer and/or at least one organic layer.In the case where the first and second insulating layers 30 and 40 aresubstantially formed of or include organic materials, flexibility of theinput sensing unit ISU may be improved. Alternatively, in the case wherethe first and second insulating layers 30 and 40 are substantiallyformed of or include inorganic materials, the input sensing unit ISU mayhave a thin structure and an improved impact resistance property. In anembodiment, various materials may be used for the first and secondinsulating layers 30 and 40, but the inventive concept is not limited tospecific materials.

FIG. 5A is an enlarged plan view illustrating a region of FIG. 3. FIGS.5B and 5C are plan views illustrating some of the elements shown in FIG.5A. For convenience in illustration, FIG. 5A illustrates a region of theinput sensing unit ISU, in which one of the first connection patternsCP1 and one of the second connection patterns CP2 are disposed. Inparticular, only conductive patterns are illustrated in FIG. 5A, but thefirst and second insulating layers 30 and 40 are omitted in FIG. 5A.

FIG. 5B illustrates the first conductive layer 10 of FIG. 5A, and FIG.5C illustrates the second conductive layer 20 of FIG. 5A. Hereinafter,an embodiment of the inventive concept will be described in more detailwith reference to FIGS. 5A to 5C.

In an embodiment, a plurality of the first sensor patterns SP1 may bedisposed to be spaced apart from each other in the first direction DR1,and a plurality of the second sensor patterns SP2 may be disposed to bespaced apart from each other in the second direction DR2. Each of thefirst connection patterns CP1 may be extended in the first direction DR1to connect the first sensor patterns SP1 to each other, and each of thesecond connection pattern CP2 may be extended in the second directionDR2 to connect the second sensor patterns SP2 to each other.

The first connection pattern CP1 and the second connection pattern CP2may be disposed on different layers or at different levels. The firstconnection pattern CP1 may be composed of mesh lines MSL or atransparent pattern. The first connection pattern CP1 and the firstsensor patterns SP1 may be disposed on different layers or at differentlevels and may be connected to each other through a contact hole CH_S.

In an embodiment, the first connection pattern CP1 is illustrated toconstitute the first conductive layer 10, and the second connectionpattern CP2, the first sensor patterns SP1, and the second sensorpatterns SP2 are illustrated to constitute the second conductive layer20.

Referring to FIGS. 5A and 5B, the first connection pattern CP1 isillustrated to have a shape, which is spaced apart from the secondconnection pattern CP2 when viewed in a plan view and is overlapped withthe first sensor patterns SP1 via the second sensor patterns SP2. In anembodiment, the first connection pattern CP1 and the first sensorpatterns SP1 may be disposed on the same layer or at the same level.Here, the first sensor patterns SP1 and the second sensor patterns SP2may be disposed on different layers or different levels, the firstconnection pattern CP1 and the first sensor patterns SP1 may be formedto form a single object, and the second connection pattern CP2 and thesecond sensor patterns SP2 may be formed to form a single object.

In an embodiment, the first connection pattern CP1 is illustrated asfirst and second sub-connection patterns CPa and CPb, which are spacedapart from each other in the second direction DR2. The firstsub-connection pattern CPa is illustrated to have a structure, in whicha first line portion A1 and a second line portion A2 extending in afourth direction DR4 and a third line portion A3 and a fourth lineportion A4 extending in a fifth direction DR5 are connected to eachother, as shown in FIG. 5B. The fourth direction DR4 and the fifthdirection DR5 may be directions that are diagonal to the first andsecond directions DR1 and DR2.

The first sub-connection pattern CPa and the second sub-connectionpattern CPb are illustrated to have a line symmetry about an axisextending in the first direction DR1. In detail, the secondsub-connection pattern CPb may include a first line portion A5 and asecond line portion A6, which are extended in the fifth direction DR5and are respectively symmetric with the first and second line portionsA1 and A2 of the first sub-connection pattern CPa, and a third lineportion A7 and a fourth line portion A8, which are extended in thefourth direction DR4 and are respectively symmetric to the third andfourth line portions A3 and A4 of the first sub-connection pattern CPa.

However, embodiments according to the inventive concept are not limitedto this example, and in an embodiment, the first connection pattern CP1may be provided as a single pattern. In addition, if the firstconnection pattern CP1 is coupled to the first sensor patterns SP1, theshape of the first connection pattern CP1 may be variously changed, andthe inventive concept is not limited to a specific embodiment.

Referring to FIG. 5C, the first sensor patterns SP1, the second sensorpatterns SP2, and the second connection pattern CP2 may be disposed on alayer, which is different from that under the first connection patternCP1, and may constitute the second conductive layer 20. For conveniencein illustration, in FIG. 5C, the first sensor patterns SP1 areillustrated with a hatched pattern.

The first sensor patterns SP1 may be spaced apart from the second sensorpatterns SP2 and the second connection pattern CP2, when viewed in aplan view. The first sensor patterns SP1 may be electricallydisconnected from the second sensor patterns SP2 and the secondconnection pattern CP2.

The second sensor patterns SP2 and the second connection pattern CP2 maybe disposed on the same layer. The second sensor patterns SP2 and thesecond connection pattern CP2 may be connected to each other to form asingle object, as shown. However, embodiments according to the inventiveconcept are not limited to this example or a specific embodiment, and inan embodiment, the second sensor patterns SP2 and the second connectionpattern CP2 may be disposed on different layers and may be coupled toeach other.

In an embodiment, each of the first sensor patterns SP1, the secondsensor patterns SP2, and the second connection pattern CP2 may becomposed of a plurality of the mesh lines MSL. The mesh lines MSL mayinclude a first mesh line MSL1, which is extended in the fourthdirection DR4, and a second mesh line MSL2, which is extended in thefifth direction DR5 to cross the first mesh line MSL1.

In the present specification, an expression “two elements cross eachother” means that extension directions of the two elements are differentfrom each other. Such elements crossing each other may be disposed onthe same layer (or at the same level) or on different layers (or atdifferent levels).

The first mesh line MSL1 and the second mesh line MSL2 may be disposedon the same layer and may be connected to each other to form a pluralityof mesh openings MSL-OP. Each of the mesh openings MSL-OP may beoverlapped with the light-emitting region PXA (e.g., see FIG. 4). Theconductive patterns shown in FIG. 4 may correspond to the mesh linesMSL.

Some of the mesh lines MSL may be cut to define a border BA between thesensor patterns. The border BA between the first sensor patterns SP1 andthe second sensor patterns SP2 may be formed by a portion, which isformed by removing a portion of the first mesh line MSL1, or by aportion, which is formed by removing a portion of the second mesh lineMSL2. In an embodiment, adjacent ones of the mesh lines MSL may beelectrically disconnected from each other by removing some of the meshlines MSL. The border BA between the first sensor patterns SP1 and thesecond sensor patterns SP2 may be easily designed along a cutting line,which is formed in the mesh lines MSL.

In an embodiment, the input sensing unit ISU may further include afloating pattern FP. For convenience in illustration, the floatingpattern FP is illustrated with a shaded pattern.

When viewed in a plan view, the floating pattern FP may be disposed at aposition overlapped with the first connection pattern CP1. In anembodiment, an overlapping area between the floating pattern FP and thefirst connection pattern CP1 may range from about 10% to 90% of an areaof the first connection pattern CP1. When the overlapping area betweenthe floating pattern FP and the first connection pattern CP1 is largerthan about 90% of the area of the first connection pattern CP1 or issmaller than 10%, the reflectance of an external light may have a largedifference between a region occupied by the first connection pattern CP1and a region located around the first connection pattern CP1 (e.g.,occupied by the second sensor patterns SP2 or the first sensor patternsSP1).

The reflectance of the external light may occur when an external lightincident to the active region AA from the outside of the electronicapparatus EA is reflected by the conductive patterns (e.g., the sensorpatterns SP1 and SP2 or the connection patterns CP1 and CP2 in the inputsensing unit ISU) or by the conductive patterns of the display unit DU(e.g., the thin film transistor or the electrodes of the light emittingdevice).

In an embodiment, the reflection of the external light will be mainlydescribed, based on the reflection of the external light in the inputsensing unit ISU. The difference in reflectance of the external lightbetween a region provided with the first connection pattern CP1 andother regions may result from that the first connection pattern CP1 isdisposed on a layer different from that under other patterns.

In an embodiment of the inventive concept, because the overlapping areabetween the floating pattern FP and the first connection pattern CP1 isdesigned to be about 10% to 90% of the area of the first connectionpattern CP1, it may be possible to reduce a difference in reflectancebetween a region occupied by the first connection pattern CP1 and aneighboring region and to prevent the first connection pattern CP1 frombeing recognized by a user.

In an embodiment, a plurality of the floating patterns FP may beprovided to be spaced apart from each other, as shown in FIG. 5C. Theplurality of the floating patterns FP may be located between the meshlines MSL. The floating pattern FP may be spaced apart from the secondsensor patterns SP2 or the second connection pattern CP2, when viewed ina plan view. Accordingly, the floating pattern FP may be electricallydisconnected from the second sensor patterns SP2 or the secondconnection pattern CP2, and thus, it may be possible to prevent thefloating pattern FP from affecting the second sensor patterns SP2 or thesecond connection pattern CP2 (i.e., an electric interference issuetherebetween).

Some of the mesh lines MSL constituting the second sensor patterns SP2may be removed, and the second sensor patterns SP2 may be spaced apartfrom the floating pattern FP. Some of the mesh lines MSL of the secondsensor patterns SP2, which are overlapped with the first connectionpattern CP1, may cross the first connection pattern CP1 and may not beextended parallel to the first connection pattern CP1.

Portions of the first mesh line MSL1 of the second sensor patterns SP2,which are overlapped with the first and second line portions A1 and A2of the first sub-connection pattern CPa or the third and fourth lineportions A7 and A8 of the second sub-connection pattern CPb extendingparallel to the first mesh line MSL1, may be removed. In addition,portions of the second mesh line MSL2 of the second sensor patterns SP2,which are overlapped with the third and fourth line portions A3 and A4of the first sub-connection pattern CPa or the first and second lineportions A5 and A6 of the second sub-connection pattern CPb extendingparallel to the second mesh line MSL2, may be removed.

Accordingly, the first mesh line MSL1 may cross the first connectionpattern CP1 in a region overlapped with the first connection pattern CP1but may not be extended in a direction parallel to the first connectionpattern CP1. Furthermore, the second mesh line MSL2 may cross the firstconnection pattern CP1 in a region overlapped with the first connectionpattern CP1 but may not be extended in a direction parallel to the firstconnection pattern CP1. Accordingly, it may be possible to reduce anoverlapping area between the second connection pattern CP2 and the firstsensor patterns SP1 and thereby to reduce a noise issue caused by aparasitic capacitance. In addition, the floating pattern FP may bespaced apart from the second sensor patterns SP2 and may be arrangedalong the first connection pattern CP1.

FIG. 6A is a sectional view taken along a line I-I′ of FIG. 5. FIG. 6Bis a sectional view taken along a line II-II′ of FIG. 5. FIG. 6C is asectional view illustrating a portion of an electronic apparatus in anembodiment of the inventive concept. For convenience in illustration,FIG. 6C illustrates a region corresponding to FIG. 6B.

As shown in FIG. 6A, the first sensor patterns SP1, the second sensorpatterns SP2, and the second connection pattern CP2 may be located onthe first connection pattern CP1. For example, the first connectionpattern CP1 may be located between the display unit DU and the firstinsulating layer 30, and the first sensor patterns SP1, the secondsensor patterns SP2, and the second connection pattern CP2 may belocated between the first insulating layer 30 and the second insulatinglayer 40. The conductive patterns constituting each of the first andsecond conductive layers 10 and 20 may mean the mesh lines MSL (e.g.,see FIG. 5A).

The first sensor patterns SP1 may be coupled to the first connectionpattern CP1 through the contact holes CH_S. The contact holes CH_S maybe formed to penetrate an insulating layer between the first and secondconductive layers 10 and 20.

As shown in FIG. 6B, in the second sensor pattern SP2, a mesh line,which is extended in a direction parallel to the first connectionpattern CP1, may not be overlapped with the first connection patternCP1, when viewed in a plan view. A mesh line of the second sensorpattern SP2, which is overlapped with the first connection pattern CP1in a plan view, may be extended in a direction crossing the firstconnection pattern CP1. Unlike the first and second mesh lines MSL1 andMSL2 of the first sensor patterns SP1 overlapped with the firstconnection pattern CP1 in a plan view, the first and second mesh linesMSL1 and MSL2 of the second sensor patterns SP2 overlapped with thefirst connection pattern CP1 in a plan view may cross the firstconnection pattern CP1.

The floating pattern FP may be arranged such that it is spaced apartfrom the first mesh line MSL1 and the second mesh line MSL2. Thefloating pattern FP may be overlapped with the first connection patternCP1, when viewed in a plan view, and may be extended in a directionparallel to an extension direction of the first connection pattern CP1.In an embodiment, a plurality of the floating patterns FP may beprovided in internal spaces of the mesh lines.

In an embodiment, the floating pattern FP may be formed of or includethe same material as the second sensor patterns SP2. Furthermore, thefloating pattern FP may be concurrently patterned by the same process asthat for the second sensor patterns SP2 (i.e., by using the same mask asthat for the second sensor patterns SP2). In this case, the floatingpattern FP may be formed during the process of forming the second sensorpatterns SP2, and thus, it may be possible to simplify the fabricationprocess and to reduce the process cost. However, embodiments accordingto the inventive concept are not limited to this example or a specificembodiment, and in an embodiment, the floating pattern FP may be formedof a material different from the second sensor patterns SP2 or may beformed by a process different from the second sensor patterns SP2.

Alternatively, as shown in FIG. 6C, the floating pattern FP may belocated on a layer, which is different from the first connection patternCP1 or the second connection pattern CP2. The floating pattern FP may belocated on the second insulating layer 40. As long as the floatingpattern FP is overlapped with the first connection pattern CP1 in a planview, the floating pattern FP may be located on a layer, which isdifferent from the second connection pattern CP2, and the inventiveconcept is not limited to this example or a specific embodiment.

In an embodiment of the inventive concept, it may be possible to reducean overlapping area between the first connection pattern CP1 and thesecond sensor pattern SP2 and thereby to easily prevent sensitivity ofthe input sensing unit ISU from being deteriorated by electricinterference between the first connection pattern CP1 and the secondsensor pattern SP2. Furthermore, in an embodiment of the inventiveconcept, because the input sensing unit ISU further includes thefloating pattern FP, it may be possible to reduce a difference invisibility of the conductive patterns between a region, in which thefirst connection pattern CP1 is located, and a region, in which thefirst connection pattern CP1 is not located. Accordingly, it may bepossible to prevent or reduce the first connection pattern CP1 beingnoticeably recognized and thereby to realize uniform visibilitythroughout the input sensing unit ISU.

In addition, in an embodiment of the inventive concept, because it maybe possible to realize the uniform visibility throughout the inputsensing unit ISU, the input sensing unit ISU may be prevented fromaffecting a quality of an image generated by the display unit DU.Accordingly, although the electronic apparatus EA includes both of thedisplay unit DU and the input sensing unit ISU, the electronic apparatusEA may provide a relatively high quality image to a user.

FIGS. 7A and 7B are plan views, each of which illustrates a portion ofan input sensing unit in an embodiment of the inventive concept. Forconvenience in illustration, the first connection pattern CP1 and afloating pattern FP-A or FP-B are illustrated in FIGS. 7A and 7B, andthe floating pattern FP-A or FP-B is illustrated as a shaded pattern.Hereinafter, an embodiment of the inventive concept will be described inmore detail with reference to FIGS. 7A and 7B.

As shown in FIG. 7A, the floating pattern FP-A may be provided as asingle object. The floating pattern FP-A may be spaced apart from thefirst sensor patterns SP1 (e.g., see FIG. 5A). When viewed in a planview, the floating pattern FP-A may be overlapped with the firstconnection pattern CP1 and may be located in a region, except for aregion provided with the contact holes CH_S of the first connectionpattern CP1.

In an embodiment, the floating pattern FP-A may cross the second sensorpatterns SP2 (e.g., see FIG. 5A), when viewed in a plan view. Forexample, in the case where the second sensor patterns SP2 have the sameshape as that shown in FIG. 5A, the floating pattern FP-A may cross thefirst or second mesh line MSL1 or MSL2, which is electricallydisconnected from the first connection pattern CP1 and crosses the firstconnection pattern CP1. In an embodiment, the floating pattern FP-A andthe first or second mesh line MSL1 or MSL2 may be located on the samelayer and may be directly connected to each other. In certainembodiments, the floating pattern FP-A and the first or second mesh lineMSL1 or MSL2 may be located on different layers to cross each other andmay be electrically disconnected from each other.

However, the inventive concept is not limited to this example, and in anembodiment, the floating pattern FP-A may be spaced apart from thesecond sensor patterns SP2, when viewed in a plan view. Here, the secondsensor patterns SP2 may be formed by removing portions of the mesh linesMSL of the second sensor patterns SP2, which are overlapped with aregion provided with the floating pattern FP-A.

In an embodiment, if the floating pattern FP-A is provided as a singleobject, the shape of the floating pattern FP-A may be variously changed.An overlapping area between the floating pattern FP-A and the firstconnection pattern CP1 may range from about 10% to 90% of the area ofthe first connection pattern CP1.

Alternatively, as shown in FIG. 7B, the floating pattern FP-B may have awidth larger than the first connection pattern CP1 overlapped therewith.For example, the floating pattern FP-B may be overlapped with a portionof the first connection pattern CP1 extending in the fourth directionDR4 to have a width greater than a width of the first connection patternCP1 in the fifth direction DR5 or may be overlapped with a portion ofthe first connection pattern CP1 extending in the fifth direction DR5 tohave a width greater than a width of the first connection pattern CP1 inthe fourth direction DR4.

In an embodiment of the inventive concept, if the floating pattern FP-Aor FP-B is overlapped with the first connection pattern CP1 when viewedin a plan view, the shape or width of the floating pattern FP-A or FP-Bmay be variously changed, but the inventive concept is not limited to aspecific embodiment. In an embodiment of the inventive concept, becausethe floating pattern FP-A or FP-B is arranged to be overlapped with thefirst connection pattern CP1, it may be possible to prevent a visibilityissue from occurring in a region provided with the first connectionpattern CP1.

FIG. 8A is a plan view illustrating an input sensing unit in anembodiment of the inventive concept. FIG. 8B is a sectional view takenalong a line III-Ill′ of FIG. 8A. For convenience in illustration, FIG.8A illustrates a region corresponding to FIG. 5A, and FIG. 8Billustrates a sectional view of an electronic apparatus EA-1. The regionshown in FIG. 8B may correspond to the region shown in FIG. 6B.Hereinafter, an embodiment of the inventive concept will be described inmore detail with reference to FIGS. 8A and 8B. Meanwhile, for concisedescription, an element previously described with reference to FIGS. 1to 7B may be identified by the same reference number without repeatingan overlapping description thereof.

A floating pattern FP-1 of an input sensing unit ISU-1 may be overlappedwith the mesh lines MSL, when viewed in a plan view. The floatingpattern FP-1 may be arranged to be overlapped with a portion of thefirst or second mesh line MSL1 or MSL2 of the mesh lines MSL, which isoverlapped with the first connection pattern CP1, is electricallydisconnected from the first connection pattern CP1, and is arranged tocross the first connection pattern CP1.

In an embodiment, the floating pattern FP-1 may be located on the secondinsulating layer 40. Accordingly, the floating pattern FP-1 may bespaced apart from the second sensor patterns SP2 when viewed in asectional view and may be electrically disconnected from the secondsensor patterns SP2.

In an embodiment of the inventive concept, if, in the input sensing unitISU-1, the floating pattern FP-1 is overlapped with the first connectionpattern CP1 when viewed in a plan view, the position of the floatingpattern FP-1 may be variously changed. The input sensing unit ISU-1 mayfurther include the floating pattern FP-1, and thus, it may be possibleto prevent the first connection pattern CP1 from being noticeablyrecognized and to provide uniform visibility to a user.

FIG. 9A is a plan view illustrating an electronic apparatus in anembodiment of the inventive concept. FIG. 9B is a plan view illustratinga portion of the electronic apparatus of FIG. 9A. For convenience inillustration, FIG. 9A illustrates a region corresponding to FIG. 3, andFIG. 9B illustrates a region of an input sensing unit ISU-2corresponding to FIG. 5A. Hereinafter, an embodiment of the inventiveconcept will be described in more detail with reference to FIGS. 9A and9B. Meanwhile, for concise description, an element previously describedwith reference to FIGS. 1 to 8B may be identified by the same referencenumber without repeating an overlapping description thereof.

As shown in FIG. 9A, an electronic apparatus EA-2 may further include athird sensing electrode TE3, a third signal line SL3, and a third padPD3. The third sensing electrode TE3 may be spaced apart from the firstsensing electrode TE1 and the second sensing electrode TE2, when viewedin a plan or sectional view. The third sensing electrode TE3 may send orreceive independent signals to or from the first sensing electrode TE1and a second sensing electrode TE2 n. The second sensing electrode TE2 nmay have a different shape from the second sensing electrode TE2 shownin FIG. 4. The second connection pattern CP2 n may have a shape similarto the second connection pattern CP2 shown in FIG. 4, but a secondsensor pattern SP2 n may have a shape enclosing a third sensor patternSP3, which will be described below.

The third sensing electrode TE3 may be extended in the second directionDR2. In an embodiment, a plurality of the third sensing electrodes TE3may be arranged in the first direction DR1. However, embodimentsaccording to the inventive concept are not limited to this example or aspecific embodiment, and in certain embodiments, the third sensingelectrode TE3 may be extended in the first direction DR1.

The third signal line SL3 may be connected to the third sensingelectrode TE3. The third signal line SL3 may be located in theperipheral region NAA and may not be recognized by a user. The thirdsignal line SL3 may connect the third sensing electrode TE3 to the thirdpad PD3. The third signal line SL3 may transmit an electrical signal,which is transmitted through the third pad PD3, to the third sensingelectrode TE3 or may transmit an electrical signal, which is providedfrom the third sensing electrode TE3, to the outside through the thirdpad PD3.

In an embodiment, the third sensing electrode TE3 may receive anindependent electrical signal from the first sensing electrode TE1 andthe second sensing electrode TE2. For example, the third sensingelectrode TE3 may sense a noise, which may occur in the active regionAA. Alternatively, the third sensing electrode TE3 may receive a groundvoltage, and in this case, it may be possible to suppress aninterference issue between the display unit DU and the input sensingunit ISU-2 and thereby to improve sensitivity of the input sensing unitISU-2. In an embodiment, the third sensing electrode TE3 may receive avariety of signals, and the inventive concept is not limited to aspecific embodiment.

The third sensing electrode TE3 may include a plurality of third sensorpatterns SP3 and a plurality of third connection patterns CP3. The thirdconnection patterns CP3 may be located between the third sensor patternsSP3 to connect adjacent ones of the third sensor patterns SP3 to eachother. In FIG. 9B, for convenience in illustration, the third sensorpatterns SP3 are illustrated as a shaded pattern.

In an embodiment, each of the third sensor patterns SP3 may have ashape, which is enclosed by a corresponding one of the second sensorpatterns SP2 n. For example, each of the third sensor patterns SP3 mayhave a rhombus shape whose sides are extended in the fourth directionDR4 and the fifth direction DR5, and each of the second sensor patternsSP2 n may have a rhombus ring shape enclosing a corresponding one of thethird sensor patterns SP3. A border BAn, which is formed by cutting themesh lines MSL, may be defined between the second sensor patterns SP2 nand the third sensor patterns SP3. However, embodiments according to theinventive concept are not limited to this example or a specificembodiment, and in an embodiment, the shape of each of the first tothird sensor patterns SP1, SP2 n, and SP3 may be variously changed.

The third connection patterns CP3 may be located between the thirdsensor patterns SP3. The third sensor patterns SP3 may be electricallyconnected to each other through the third connection patterns CP3. Thethird connection patterns CP3 may be coupled to the third sensorpatterns SP3 through the second sensor patterns SP2 n and the firstsensor patterns SP1.

Here, the third connection patterns CP3 may be partially overlapped withthe first sensor patterns SP1. Some of the first sensor patterns SP1 maybe removed such that the first sensor patterns SP1 are not overlappedwith the third connection patterns CP3. For example, portions of themesh lines MSL of the first sensor patterns SP1 (e.g., a portion of thefirst or second mesh line MSL1 or MSL2, which is overlapped with thethird connection pattern CP3 when viewed in a plan view and is extendedparallel to the third connection pattern CP3) may be removed.Accordingly, a portion of the mesh lines MSL of the first sensorpatterns SP1, which is located in a region overlapped with the thirdconnection pattern CP3, may cross the third connection pattern CP3 andmay not be parallel to the third connection pattern CP3.

The third connection pattern CP3 may be located on a layer differentfrom the first sensor patterns SP1 and the second sensor patterns SP2.Accordingly, the third connection pattern CP3 may be electricallydisconnected from the first sensor patterns SP1 and the second sensorpatterns SP2 n, even when the third connection pattern CP3 is overlappedwith the first sensor patterns SP1 and the second sensor patterns SP2when viewed in a plan view.

The third connection pattern CP3 and the first connection pattern CP1may be located on the same layer or at the same level. The thirdconnection pattern CP3 may stably prevent an electric short circuit withthe first connection pattern CP1, because the third connection patternCP3 is spaced apart from the first connection pattern CP1 when viewed ina plan view.

In an embodiment, the input sensing unit ISU-2 may include a firstfloating pattern FP1 and a second floating pattern FP2. The firstfloating pattern FP1 may be arranged to be overlapped with the firstconnection pattern CP1, when viewed in a plan view. The first floatingpattern FP1 may correspond to the floating pattern FP shown in FIG. 5A,and thus, an overlapping description will be omitted.

The second floating pattern FP2 may be arranged to be overlapped withthe third connection pattern CP3, when viewed in a plan view. In anembodiment, a plurality of the second floating patterns FP2 may beprovided and may be arranged side by side in an extension direction ofthe third connection pattern CP3. The second floating pattern FP2 may bespaced apart from the mesh lines MSL constituting the first sensorpatterns SP1.

The second floating pattern FP2 may reduce a difference in reflectancebetween a region, in which the third connection pattern CP3 is located,and a region, in which the third connection pattern CP3 is not located.Because the input sensing unit ISU-2 further includes the secondfloating pattern FP2, it may be possible to prevent the third connectionpattern CP3 from being easily recognized and to realize uniformvisibility throughout the input sensing unit ISU-2. However, embodimentsaccording to the inventive concept are not limited to this example or aspecific embodiment, and one of the first and second floating patternsFP1 and FP2 may be omitted from the input sensing unit ISU-2.

In an embodiment of the inventive concept, it may be possible to preventsome of conductive patterns of an input sensing unit from beingnoticeably recognized and thereby to realize uniform visibility of animage, which is provided to a user, throughout the input sensing unit.In addition, in an embodiment of the inventive concept, it may bepossible to realize uniform visibility throughout an active region, onwhich an image is displayed, and thereby to prevent an image qualityfrom being deteriorated by the input sensing unit.

While example embodiments of the inventive concepts have beenparticularly shown and described, it will be understood by one ofordinary skill in the art that variations in form and detail may be madetherein without departing from the spirit and scope of the attachedclaims, and their equivalents.

What is claimed is:
 1. An input sensor, comprising: a first sensingelectrode comprising first sensing patterns and a first pattern locatedon a layer different from the first sensing patterns and located betweenthe first sensing patterns; a second sensing electrode located on a samelayer as the first sensing patterns and insulated from the first sensingelectrode; and a floating pattern comprising a plurality of segmentseach overlapping the first pattern and insulated from the second sensingelectrode, wherein at least one of the plurality of segments issurrounded by a portion of the second sensing electrode overlapping thefirst pattern.
 2. The input sensor of claim 1, wherein the floatingpattern is on the same layer as the first sensing patterns.
 3. The inputsensor of claim 1, wherein the first sensing patterns, the secondsensing electrode, and the plurality of segments comprise mesh linesextending in a direction crossing each other.
 4. The input sensor ofclaim 3, wherein the plurality of segments has different shapes fromeach other.
 5. The input sensor of claim 3, wherein a sum of areas ofthe plurality of segments is smaller than an area of the first pattern.6. The input sensor of claim 3, wherein at least one of the mesh linesincluded in the plurality of segments is surrounded by the mesh linesincluded in the second sensing electrode overlapping the first pattern.7. The input sensor of claim 1, wherein the floating pattern comprises asame material as the second sensing electrode.
 8. The input sensor ofclaim 1, further comprising a sensing insulating layer that covers thefirst pattern and on which the first sensing patterns, the secondsensing electrode, and the floating pattern are located, wherein thefirst pattern is connected to the first sensing patterns through acontact hole of the sensing insulating layer.
 9. The input sensor ofclaim 1, further comprising a first sensing insulating layer that coversthe first pattern and on which the first sensing patterns and the secondsensing electrode are located, and a second sensing insulating layerthat covers the first sensing patterns and the second sensing electrode,and on which the floating pattern is located.
 10. The input sensor ofclaim 1, wherein an overlapping area between the floating pattern andthe first pattern is about 10% or more and 90% or less of an area of thefirst pattern.
 11. An electronic apparatus, comprising: a display unitcomprising pixels to provide light to light emitting areas; and an inputsensor comprising a sensing insulating layer, a first sensing electrodecomprising first sensing patterns on the sensing insulating layer and afirst pattern under the sensing insulating layer and connected to thefirst sensing patterns, a second sensing electrode on the sensinginsulating layer and insulated from the first sensing electrode, and afloating pattern comprising a plurality of segments each overlapping thefirst pattern and insulated from the second sensing electrode, whereinat least one of the plurality of segments is surrounded by a portion ofthe second sensing electrode overlapping the first pattern.
 12. Theelectronic apparatus of claim 11, wherein the floating pattern is on thesensing insulating layer.
 13. The electronic apparatus of claim 11,wherein the first sensing patterns, the second sensing electrode, andthe plurality of segments comprise mesh lines extending in a directioncrossing each other, and the mesh lines do not overlap the lightemitting areas.
 14. The electronic apparatus of claim 13, wherein atleast one of the mesh lines included in the plurality of segments issurrounded by the mesh lines included in the second sensing electrodeoverlapping the first pattern.
 15. The electronic apparatus of claim 11,wherein the floating pattern comprises a same material as the secondsensing electrode.